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Target
Application：

Electronic semiconductor industry
Characteristics：

Rod: High purity, high cleanliness, good composition consistency, high density, uniform grain, and low resistivity. Wire: God composition consistency, high elongation, high tensile strength, high roundness, smooth surface, and low resistivity. Ingot: High purity, high cleanliness, good composition consistency, high density, uniform grain, and low resistivity;
Parameter Range：

Rod: ?120 ~ 340 * L; wire: ?0.3- 6mm; high purity aluminum ingot: 560 * 270 * 1800mm
Standards：

Technical standards such as international standard IEC61851 etc.
Main Products

Bonding wire

Ingot

LCD panel target blank

Rod

Semi-conductor target blank

Wire

  • Purity Al99.99%-Al99.9995% , high purity aluminum has uniform internal structure, low gas content (H < 0.15ppm, C / N / O < 10ppm), low slag content, good internal structure, composition consistency and stability.
  • Ingot
  • Purity≥Al99.999% , high purity aluminum has uniform internal structure, low gas content (H < 0.15ppm, C / N / O < 10ppm), low slag content, good internal structure, composition consistency and stability
  • Rod
  • Purity≥Al99.9995% , high purity aluminum has uniform internal structure, low gas content (H < 0.15ppm, C / N / O < 10ppm), low slag content, good internal structure, composition consistency and stability.
  • Wire
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